At Future Facilities, we are committed to delivering the most accurate, user-centric thermal simulation tools for the electronics cooling market. From our Heat is On research that surveyed over 350 design engineers to our State of Thermal research that surveyed 170 simulation specialists, we are committed to understanding both our customers’ needs and the wider market as a whole.
In this Thermal Focus Report, we brought together nine thermal experts from some of the world’s leading brands, including Facebook, HP Enterprise, QuantaCool and CommScope, to discuss the key electronics challenges facing the IT industry, as well as the new computing technologies that represent the largest emerging opportunities in the market (see below for more details).
Over the last decade, changing industry expectations have driven unprecedented developments in electronics and IT equipment. Our expert panel tackled the following questions: How will new technologies and working practices impact electronics design?
What specific criteria will engineers have to keep in mind during the design process?
This Thermal Focus Report also addresses how Artificial Intelligence (AI) will shape a variety of future industry trends, from chip design to software. Some of our expert panel noted major changes at play that today’s engineers should keep in mind with respect to data, storage and thermal compliance.
Providing much of the data needed to inform AI, the internet of things (IoT) will bring its own unique set of thermal challenges. Our expert panel addressed the changing thermal demands that will have the greatest impact on today’s engineers, as well as the techniques they’ll likely need to employ to undertake the challenges that come with IoT electronics design.
As the growth of the IoT and IoT devices gathers pace, edge computing will become critical to information management and the wider infrastructure of the new, interconnected world. How will edge computing disrupt the data center landscape? What new thermal considerations does edge computing bring to the design process?