At Future Facilities, we are committed to delivering the most accurate, user-centric thermal simulation tools for the electronics cooling market. In this report, we brought together nine thermal experts from leading brands—including Facebook, HP Enterprise, QuantaCool and CommScope—to discuss the emerging challenges facing the electronics industry.
“Given how the electronics industry is changing, we now have to start modeling simulations at least three or four years in advance.”
“The IoT demands robust devices that operate in harsh environments. This will drive thermal designs that have to operate under very high humidity, mixed temperature cycling, all of which will cause reliability issues. To achieve this, game-changing developments will be needed across the thermal industry.”
Univeristy of Binghamton