6SigmaET in the Industry


Used by industry leaders such as Motorola, Facebook, DELL, HP, Cisco, Lenovo, and Technicolor

Thermal simulation is a key element of the engineering design process. Our software enables you to create and solve models quickly, verify electronic designs before manufacturing, and optimize the best thermal performance while reducing your time to market. 6SigmaET enables you to spend more time on design, and less time on software operations.

Rohde & Schwarz Analysis

Why Switch to 6SigmaET?

Rohde & Schwarz adopted 6SigmaET for use in its device designs, as well as some assembly use cases and chip designs. With devices getting both smaller and more  powerful, Rohde & Schwarz understood that thermal management was vital to ensure its products are reliable and meet the highest quality standards.

Having been let down by the limited functionality, and slow speeds, offered by previous simulation tools, Rohde & Schwarz turned to Future Facilities' 6SigmaET to offer a faster and more complete solution.

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Rohde & Schwarz Case Study - Image

LED Replacement Light Bulb - Image

LED Replacement Light Bulb

Improving Thermal Performance

ATS Europe created a thermal simulation of a LED replacement light bulb using 6SigmaET. The aim of the project was to develop a thermal management solution for the LED bulb without having to use a large heat sink. The form factor of bulb needed to be the same as a traditional light bulb. A thermal simulation was performed using 6SigmaET to verify the design. The predicted temperatures were within 5% of the experimental temperature measurements.
 

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LED Heat Sink Performance

Changing the Orientation

Optimal Thermal Solutions BV used the 6SigmaET simulation software to examine the effect of the orientation of an LED heatsink on thermal performance. The two heat sinks investigated included an extruded heat sink (ModuLED9980) and a pin fin heatsink (LPF11180-ZHE). The simulation results were compared with measured values, and the maximum difference between the test and simulation data was found to be 1.9 K or 5%.
 

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LED Heat Sink Performance - Image

LED Down Lighter - Image

LED Down Lighter

Junction Temperature Analysis

ATS Europe have created a thermal simulation of an LED Down Lighter. The simulation was used to evaluate different configurations of the printed circuit board (PCB). 6SigmaET was able to predict LED junction temperature to within 5% of the experimental temperature measurements.
 

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Natural Convection LED Applications

Evaluation of Environment on Heat Sink Performance

Optimal Thermal Solutions BV used the 6SigmaET simulation software to investigate the effect that the environment has on the thermal performance of a LED heat sink. The performance of an LPF80A50 heat sink was examined in an open environment of UL6” format. The simulation results were compared with measured values, and the average difference between the test and simulation data was found to be 3.5%.
 

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Natural Convection LED Applications - Image

ATS: LED Street Lamp - Image

 

ATS: LED Street Lamp

Optimization through Internal Improvements

In order to identify suitable design changes which would improve thermal performance, ATS Europe used Future Facilities’ 6SigmaET simulation software to simulate the existing LED replacement street lamp. The results were verified against experimental data obtained. Design modifications were made to the lamp’s internal structure, with the outer casing unchanged. 

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Raspberry Pi 3 Case Study

Thermal Management of the Raspberry Pi 3

Soon after the launch of the Raspberry Pi 3 in February 2016 users started reporting overheating issues with the new version. The 6SigmaET team decided to investigate these reports through thermal simulation and measurements to provide some insight and advice on the best cooling strategies for users planning to operate the Pi 3 at maximum capacity.
 

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Raspberry Pi 3 Case Study - Image

Rack Mounted Telecommunication Module - Image

Rack Mounted Telecommunication Module

Forced convection

Alcatel Lucent created a thermal model of a rack mounted telecommunication module using 6SigmaET. The telecommunication module is high powered and is cooled by forced convection. The results of the thermal simulation have an excellent correlation with measured temperatures.

Ambient Temperature: 50 °C
Grid Cells: 17,680,294 
Solve time: 3h:48m
Temperature measured with thermocouples.

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Remote Radio Head

Robust. Rugged. Refined.

Alcatel Lucent created a thermal model of a telecommunication cabinet. The cabinet houses a range of different equipment with different cooling requirements. This means that the flow inside the cabinet is complex. The results of the thermal simulation have an excellent correlation with measured temperatures.

Ambient Temperature: 45 °C
Grid Cells: 19,564,803
Solve time: 5h:32m
Temperature measured with thermocouples

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Remote Radio Head - Image

Fine Pitch BGA 208 - Image

Fine Pitch BGA 208

Approaching Reality at the Component Scale

Thales Global Services divisions has carried out thermal simulations of a complex electronic component at an unprecedented level of detail using 6SigmaET. In modelling the component, it has been possible to import all the copper tracks, for both the component and the board, in an STL format. This is all thanks to the powerful functionality of 6SigmaET. The thermal simulation was employed to create a compact RC network model that could be used in system level analysis.

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Telecommunication Cabinet

As much detail as you want

Alcatel Lucent created a thermal model of a telecommunication cabinet. The cabinet houses a range of different equipment with different cooling requirements. This means that the flow inside the cabinet is complex. The results of the thermal simulation have an excellent correlation with measured temperatures.

Ambient Temperature: 45 °C
Grid Cells: 19,564,803
Solve time: 5h:32m
Temperature measured with thermocouples

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Telecommunication Cabinet - Image