The Heat is On

27 January, 2017


New research from 6SigmaET team at Future Facilities, the leading thermal simulation tool provider, has found that 1 in 5 engineers confirm thermal issues are a common cause of expensive and time-consuming late stage design complications. Despite this, the survey of over 350 professional electronics engineers also revealed that 40% of engineers still consider thermal considerations to be a low priority in their current design process. 

In fact, over a third of engineers agreed that thermal challenges are "irritations they could do without". This attitude is surprising given the impact that inadequate thermal design can have on electronic devices. From consumer gadgets to industrial electronics, excess heat reduces performance, impacts reliability and literally makes devices too hot to handle. However, rather than focus on these factors, nearly two thirds of engineers claim it is easier to 'over engineer' the thermal aspects of their designs rather than use tools to optimise thermal performance. 

These findings are detailed in The Heat is On, a new report published today by the 6SigmaET team. The report examines the challenges and priorities of current electronics design and highlights how thermal considerations are too often neglected - particularly early in the design process.