Welcome to our Frequently Asked Questions (FAQ) page. Here you will find answers to some of the most common questions that we get asked about 6SigmaET, engineering simulation and more. If you have a question that isn't answered here, please contact us.
Yes, 6SigmaET can import CAD in any format seamlessly. The software is designed to work CAD shapes which can be ‘converted’ to native objects to take advantage ET’s object based gridding among other things.
Yes, ET can do transient analysis within the basic 6SigmaET interface. There are no additional hidden costs to carry out transient and other advanced simulations such as Joule Heating, Solar Radiation, and Heat Radiation.
Yes, we have a host of native objects that can be used to model fans. User also have the option to input fan curves, automatic altitude derating, and the ability to create complicated fan-control strategies based on the sensor temperature elsewhere. Apart from the native objects, we have an extensive library of fans from fan vendors pre-configured with appropriate Fan Curves that users can take advantage of.
Yes, it is very easy and intuitive to setup liquid cooling systems in ET. Users can take advantage of objects like Pumps, Cooling Ducts, and Heatsinks to create an easy assembly. Also, ET’s ability to work seamlessly with CAD files makes working with complicated flow loops and designs simple.
6SigmaET has the flexibility to model components and other native objects as simple cuboids, to reduce complexity and size of the model, or as explicit objects that are completely parameterized. The Package Builder feature lets the user design explicit detailed packages from commonly available package types like PBGA, FPBGA, PQFP, TBGA and Flip Chip.
We have a propriety solver which is optimized to run on our unique grid which is created using a technique called Multi-Level Unstructured Staggered Grid, wherein we combine the advantages of both Structured and Unstructured grid together, along with the latest Data Structure algorithms making our solver not only accurate, stable but also The Fastest as confirmed independently by the industry.
With unlimited space, power and budget, it’s easy to design a cooling system for almost any equipment. However, in reality, all equipment has rigid specifications: you need to reduce power requirements, system weight and cost without compromising performance and reliability. Thermal simulation allows you to experiment with optimization – such as modifying heatsink geometry or reducing fan speeds – in a virtual environment. This is faster, cheaper and safer than physical experimentation and measurement.
No design is complete without using prototypes to test the system, but how many are needed to find the right solution? If problems are discovered, how long will the project be delayed while you fix them? With any late-stage design modifications, there are significant costs required to fix issues. These issues can be identified earlier if thermal simulation is used as part of the design process, reducing the number of prototypes needed for verification.
Thermal simulation can be used at any stage of thermal design. However, it is most effective when used early. Simulation can show you a range of chassis designs and proposed component layouts on the PCB. This allows you to understand the type of heatsink design required, and helps you to size the right fan (where applicable). It also helps EEs and MEs communicate with you in a more meaningful way, setting the stage for more cooperative product development.