Tackling Thermal Challenges in Modern Electronics: a workshop

16 July, 2018


Electronics engineers are under pressure to deliver products in ever shorter timelines and at a lower cost. This means that designers need to make more intelligent use of sophisticated design tools across the entire design flow. In particular, delivering a robust thermal solution is a key priority for device designers today. How though can engineers make better use of thermal simulation and design tools and meet these challenges?

To help make thermal design as easy as possible we are hosting a free, hands-on workshop to help designers and engineers learn how to tackle the thermal challenges in modern electronics, from concept to final validation. The workshop is being hosted by Future Facilities in tandem with Advanced Thermal Solutions, Inc. (ATS) – a leading engineering and manufacturing company focused on the thermal management of electronics, and an experienced 6SigmaET user. 

A key section of the workshop will be devoted to modeling and simulation using 6SigmaET. 6SigmaET is at the forefront of delivering the simulation solutions that enables thermal engineers to meet the growing demands of the electronics industry. A recent, independent study by Rohde & Schwarz found that 6SigmaET delivered faster preparation, pre-processing and faster solving times, respectively. Demonstrating an overall increase in design efficiency of 35% compared to other simulation platforms.

The session will be led by Kaveh Azar, Ph.D., the president, CEO, and founder of ATS, and Ananth Sridhar, Applications Engineer at Future Facilities – providing deep insights into CFD techniques in electronics cooling.

The workshop will take place on September 12, 2018 at the offices of ATS in Norwood, MA. To register for the event, click through to our sign up page.