18 November, 2019
6SigmaET empowers the thermal engineer to work with precision from the system level down to the die. The 6SigmaET Power Map feature gives the engineer control over the localized power distribution of a component or subcomponent. In the previous release (R13), we introduced Multiple Temperature Dependent Power Curves for components to model the throttling of power over multiple values. In R14, this feature has been expanded to allow for multiple temperature dependent power maps.
The Multiple Temperature Dependent Power Maps feature allows the precision of power maps to be coupled with power throttling – instead of a single power value. This can be done by starting with a high-power map and switching to a low-power map once a specified temperature condition is reached. Once the component has been sufficiently cooled and a specified low-temperature condition is met, the component switches back to the high-power map and so on.
To implement a temperature dependent power map on a component, first ensure that “Allow Temperature Dependent Power” is marked under Solid Objects in the Solution Control Property sheet (accessible through Cooling>Solution Control). Next, ensure that the component is being modeled as “Simplified” under the construction ribbon in the Component Property Sheet. Then, under Power Specification, select Power Map and check the “Temperature Dependent Power Map” box. Finally, click “Select” next to Multiple Power Maps to bring up the Component Multiple Power Map Editor.
Figure 1. Component property sheet
From here, a power map can be uploaded from a .csv file. The power map discretizes the component surface into a uniform map throughout which power values are specified. There is no limit to the number of power maps which can be added for a given simulation. For this example, a high-power and low-power map are considered. The high-power case has a 0.2W power input for each cell within the die. Once the component temperature reaches 40 °C, the power throttles to 0.025 watts per cell until the temperature has reduced to 30 °C.
Figure 2. Component Multiple Power Map Editor: high-powered map
Figure 3. Component Multiple Power Map Editor: low-powered map
This control strategy results in thermal cycling which maintains the chip temperature below the 40 °C setpoint throughout the transient operation, as seen in Figure 4.
Figure 4. Component temperature response during transient operation
Figure 5. Temperature distribution due to precise power map
6SigmaET’s Multiple Power Map feature is a powerful and precise tool for simulating a component’s thermal response due to power throttling. With industry-leading simulation capabilities from the system level down to the die level, 6SigmaET is the comprehensive tool for electronics cooling simulation.
Learn more about new and updated features in 6SigmaET Release 14 here.
Blog written by: Joseph Warner, Applications Engineer