Compact Component Modeling: Model the Multi-Resistor Network Faster with 6SigmaET

29 August, 2019

With technological advancements in package design, component manufacturers find it imperative to protect their intellectual property (IP) that gives them the competitive edge. While a thermal model is most accurate when using a detailed representation of the package, it is often the case that thermal engineers receive corresponding resistance values instead of the physical construction and dimensions of sub-components (dies, solder balls, encapsulant, etc.) from manufacturers in an effort to protect their IP. This raises the question – can we accurately model the heat transfer within the given component using only resistance values and input power?

With the Compact Component Modeling tool in 6SigmaET, you can.  

Compact Component Modeling and the Resistor Network

Figure 1. A component resistor network

In 6SigmaET, one of the modeling levels for component modeling is the Compact Modeling Level. This is used when the component is neither represented as merely a lumped block (Simplified) with assigned power or as a detailed prototype (Detailed) of the component – rather the relationship between sub-component is shown as resistances. This in effect is visualized as a resistor network within the component.

The Compact Modeling Level provides more information than a Two Resistance (2R) model–which uses resistance values that are calculated under a limited set of boundary conditions (i.e. junction-to-case, junction-to-board). The Compact component model can be applicable to a range of scenarios that the 2R model does not cover.

In other words, a Compact component model is a logical representation of a Detailed model, using a multi-resistor network instead of modeling individual subcomponents. This tool allows the user to map out the component faster and still capture the heat distribution across the component (top, bottom, sides, across power sources, etc.). A Compact model can be solved faster than a Detailed model, but still contains enough detail to be able to accurately predict die temperatures. 

How to Use the Compact Component Modeling Tool in 6SigmaET

First, create or select the component you wish to model and/or analyze. Under the Component Property Sheet, open the Construction tab and change the Modeling Level to Compact. 

Figure 2. Component Property Sheet>Construction>Modeling Level>Compact

From here, select Resistor Network under the Component tab. Doing so will open a new tab that shows the default resistor network.

Figure 3. Object>Component>Resistor Network

Based on resistance values obtained from component manufactures, the user can easily modify the number of internal and external nodes as well as junctions from within the Resistor Network without having to simulate these explicitly on the model itself. At 6SigmaET, we have relationships with various component manufacturers and can help with acquiring this data.

To add a node, simply right click within the Resistor Network and select the appropriate type of Node you would like to create (e.g. New General External Node, New Internal Node). To add a junction, right click the node and select New Connection and drag the line to the relevant node of your choice. 


Figure 4. Add or remove dies, power resistances, etc. to your Resistor Network easily with the Compact Component Modeling Tool

Compact Component Modeling and the Resistor Network: Simplify Process

6SigmaET enables users to easily toggle the representation of components. From a simple block to a multi-resistor network, 6SigmaET can model components in several useful and efficient ways to enhance the electronics design process. Compact Component Modeling is one such example because it allows the engineer to solve models quickly while also capturing temperature distributions caused by the internal structure of the real component. 

Interested in what else 6SigmaET can offer the electronics design process? Check out our 10-year animated timeline to see what else we’ve been up to over the years.

Blog written by: Priam Fernandes, Sales Manager & Danielle Gibson, Technical Marketing Writer