Google TPU: Thermal Management in Machine Learning
For much of the electronics community, 2018 has been the year that artificial intelligence – in p…
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SEMI-THERM 2019, March 18-22, San Jose USA
SEMI-THERM is a conference and exhibition for people interested in thermal design, management and…
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2 years ago
Putting a Price on Thermal Failure
Today’s electronic engineers face challenges coming at them from all angles. Balancing power, hea…
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2 years ago
Mixed Mode PCB Layers to Accelerate Design
Mixed Mode for PCB layer modeling is now available in Release 13 of 6SigmaET. In the previous relea…
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2 years ago
Integrating the Thermal Design Experience with the Import Properties Tool
6SigmaET is known for its intelligent automation and accurate modeling that shortens design time an…
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2 years ago
Why Touch Temperature Matters
Consumers want wearable/ hand-held devices with extended battery life, optimized performance and co…
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2 years ago
Accelerating the Thermal Process with Enhanced CAD Integration
3D CAD is integral to the engineering design process and handling complex CAD is one of the key fea…
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2 years ago
Why Do We Need a Neutral File Format?
Sharing models with different toolsets is a well-known, costly industry problem. At Intel, we led t…
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2 years ago
6SigmaET R13 Available Now
Today, we have released the latest version of 6SigmaET – Release 13. This version of 6SigmaET o…
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2 years ago
'Numbers speak for themselves in this case'
Future Facilities wins Design Tools and Development Software Award at Elektra Awards 2018 PRESS RELE…
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2 years ago
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