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Release 14: Introducing the Unified Solver

6SigmaET provides the engineer with significant flexibility to accommodate every organization’s s…
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10 months ago

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Embedded Computing Design Podcast Highlights

With 6SigmaET celebrating its ten-year anniversary this year, we were lucky enough to be invited on…
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10 months ago

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Thermal Simulation of a Smart Pole Housing Active Electronics

The past decade saw the development of IoT devices and the rise of smart homes – where all househ…
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11 months ago

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Compact Component Modeling: Model the Multi-Resistor Network Faster with 6SigmaET

With technological advancements in package design, component manufacturers find it imperative to pr…
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1 year ago

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Burning Issues: The Thermal Challenges of “Wearables”

Wearable technology is on the rise. From fitness trackers and smartwatches, to implantables and hea…
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1 year ago

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Internal Fans: The Future of Smartphone Electronics?

Last month, Chinese smartphone company Nubia Technology broke the mold for mobile cooling, introduc…
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1 year ago

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Package Design: Simplify Process and Maximize Detail with the Package Builder

When discussing package design with our users and prospective clients, we found that two primary is…
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1 year ago

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Ten Years of Simulation with 6SigmaET

This month, we at Future Facilities are celebrating ten years since the first release of our award-…
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1 year ago

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New Power Map Feature: Simplified Modeling Made More Accurate

Previously, 6SigmaET could model the distribution of additional power to the top and bottom of a PC…
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1 year ago

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