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Burning Issues: The Thermal Challenges of “Wearables”

Wearable technology is on the rise. From fitness trackers and smartwatches, to implantables and hea…
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2 weeks ago

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Internal Fans: The Future of Smartphone Electronics?

Last month, Chinese smartphone company Nubia Technology broke the mold for mobile cooling, introduc…
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1 month ago

package builder ET blog

Package Design: Simplify Process and Maximize Detail with the Package Builder

When discussing package design with our users and prospective clients, we found that two primary is…
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1 month ago

10 year anniversary 6SigmaET

Ten Years of Simulation with 6SigmaET

This month, we at Future Facilities are celebrating ten years since the first release of our award-…
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1 month ago

power map blog

New Power Map Feature: Simplified Modeling Made More Accurate

Previously, 6SigmaET could model the distribution of additional power to the top and bottom of a PC…
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2 months ago

electro thermal co simulation blog

CDNLive: The Importance of Electro-Thermal Co-Simulation in the Electronics Industry

Last month, I gave a talk at Cadence’s CDNLive event on the changing nature of electronics and th…
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2 months ago

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6SigmaET Workshop 2019, 11 June 2019, London UK

 You are invited to attend a free introductory 6SigmaET Workshop in London on Tuesday, 11 June 201…
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3 months ago

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PCB Design & Manufacturing Live 2019, 9 May 2019, Silverstone UK

PCB Design & Manufacturing Live is the UK’s only dedicated exhibition for sourcing the electronic…
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4 months ago

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Model Contact Resistance on Any Surface or CAD Shape

At Future Facilities, we are committed to delivering simulation software that replicates real-life…
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4 months ago

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