11 December, 2018
Today, we have released the latest version of 6SigmaET – Release 13. This version of 6SigmaET offers a wealth of new and enhanced functionality, designed to improve modeling efficiency and connectivity between engineering design tools.
Over the next few months, we will be detailing the new features in Release 13 in this blog. We will explain how the new functionality will make your life easier and provide tips and tricks, so you can make the most out of the software.
Here is an overview of the areas of the software we have improved in 6SigmaET Release 13.
Neutral File Format
One of the requests we often hear from our customers is that they want to open thermal models in 6SigmaET created by their suppliers and partners that have been created in other thermal simulation software.
Over the past year, Future Facilities has been working with Intel, as well as Mentor and Ansys to implement a neutral file format that enables the exchange of thermal models between software tools. Intel released an XML schema in August and Release 13 6SigmaET supports the import and export of this format.
Expanded CAD Integration
We have made CAD import even easier in Release 13. We now can directly import models using STEP or IGES format. When importing STEP or IGES, we now include the full part name, CAD hierarchy, and object color from your CAD tool. This change should help you to identify and configure CAD parts.
Many of our customers wanted the ability to define the contact resistance between two or more objects. You can now apply contact resistance to individual faces of CAD objects, enabling more accurate prediction of the heat transfer between two touching objects.
Different surface treatments can be applied to each face of a CAD object in Release 13, allowing you to model scenarios, such as painted or polished surfaces. Similarly, we have enabled simulation results reporting for each face of an object.
Throttling: Controlling Component Power
In modern devices, microprocessors continuously vary processor utilization to maximize performance while keeping the device within its thermal limits. Processor frequencies are reduced, or cores are switched off, in a process known as thermal throttling.
Release 13 adds new functionality to simulate complex thermal throttling. You can now control power dissipation based on sensor temperature, transition devices to different power profiles based on temperature or, for highly sophisticated power schemes, 6SigmaET can integrate with control system simulation software.
PCB Modeling Improvements
Simulating a PCB efficiently can be challenging – their designs are often complicated, with thousands of traces, vias, and hundreds of components. 6SigmaET’s range of PCB modeling options helps you to simulate everything from concepts to final detailed designs.
Release 13 adds a new PCB modeling level called Mixed Mode, which enables you to simplify the modeling of the PCB layer, while also modeling some traces in full detail. In turn, we have added the ability to specify the power across a PCB using a power map, which allows you to precisely define an area of the PCB with high power.
6SigmaET is now available to download from the User forum. For more information about Release 13, click here.
Keep checking back to the 6SigmaET blog to learn more about the functionality in 6SigmaET R13.
Blog written by: Tom Gregory, Product Manager