Compact Component Modeling: Model the Multi-Resistor Network Faster with 6SigmaET
With technological advancements in package design, component manufacturers find it imperative to pr…
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2 weeks ago
Burning Issues: The Thermal Challenges of “Wearables”
Wearable technology is on the rise. From fitness trackers and smartwatches, to implantables and hea…
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1 month ago
Internal Fans: The Future of Smartphone Electronics?
Last month, Chinese smartphone company Nubia Technology broke the mold for mobile cooling, introduc…
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1 month ago
Package Design: Simplify Process and Maximize Detail with the Package Builder
When discussing package design with our users and prospective clients, we found that two primary is…
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2 months ago
Ten Years of Simulation with 6SigmaET
This month, we at Future Facilities are celebrating ten years since the first release of our award-…
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2 months ago
New Power Map Feature: Simplified Modeling Made More Accurate
Previously, 6SigmaET could model the distribution of additional power to the top and bottom of a PC…
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3 months ago
CDNLive: The Importance of Electro-Thermal Co-Simulation in the Electronics Industry
Last month, I gave a talk at Cadence’s CDNLive event on the changing nature of electronics and th…
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3 months ago
6SigmaET Workshop 2019, 11 June 2019, London UK
You are invited to attend a free introductory 6SigmaET Workshop in London on Tuesday, 11 June 201…
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4 months ago
PCB Design & Manufacturing Live 2019, 9 May 2019, Silverstone UK
PCB Design & Manufacturing Live is the UK’s only dedicated exhibition for sourcing the electronic…
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4 months ago
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