Release 14: Introducing Optimization
Complex design decisions require powerful tools. Electronics are increasingly pushed towards applic…
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7 hours ago
Release 14: Introducing Temperature Dependent Power Maps
6SigmaET empowers the thermal engineer to work with precision from the system level down to the die…
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7 hours ago
Release 14: Introducing the Unified Solver
6SigmaET provides the engineer with significant flexibility to accommodate every organization’s s…
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7 hours ago
Thermal Simulation of a Smart Pole Housing Active Electronics
The past decade saw the development of IoT devices and the rise of smart homes – where all househ…
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1 month ago
Compact Component Modeling: Model the Multi-Resistor Network Faster with 6SigmaET
With technological advancements in package design, component manufacturers find it imperative to pr…
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2 months ago
Burning Issues: The Thermal Challenges of “Wearables”
Wearable technology is on the rise. From fitness trackers and smartwatches, to implantables and hea…
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3 months ago
Internal Fans: The Future of Smartphone Electronics?
Last month, Chinese smartphone company Nubia Technology broke the mold for mobile cooling, introduc…
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3 months ago
Package Design: Simplify Process and Maximize Detail with the Package Builder
When discussing package design with our users and prospective clients, we found that two primary is…
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4 months ago
Ten Years of Simulation with 6SigmaET
This month, we at Future Facilities are celebrating ten years since the first release of our award-…
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4 months ago
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