Release 14: Introducing IPC-2581 Import Capability
Data transfer continues to be an electronics design bottleneck; however, certain global file format…
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2 weeks ago
Liquid Cooling: 2020 Thermal Trends at the Semi-Therm Workshop
At the end of 2019, we attended the annual Semi-Therm symposium. Always an interesting and engaging…
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4 weeks ago
Advancing AI Hardware: The Thermal Implications
Competition within the world of artificial intelligence hardware is heating up. The recent Hot Chi…
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2 months ago
Release 14: Introducing Temperature Dependent Power Maps
6SigmaET empowers the thermal engineer to work with precision from the system level down to the die…
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3 months ago
Release 14: Introducing the Unified Solver
6SigmaET provides the engineer with significant flexibility to accommodate every organization’s s…
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3 months ago
Embedded Computing Design Podcast Highlights
With 6SigmaET celebrating its ten-year anniversary this year, we were lucky enough to be invited on…
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3 months ago
Thermal Simulation of a Smart Pole Housing Active Electronics
The past decade saw the development of IoT devices and the rise of smart homes – where all househ…
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4 months ago
Compact Component Modeling: Model the Multi-Resistor Network Faster with 6SigmaET
With technological advancements in package design, component manufacturers find it imperative to pr…
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5 months ago
Burning Issues: The Thermal Challenges of “Wearables”
Wearable technology is on the rise. From fitness trackers and smartwatches, to implantables and hea…
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6 months ago
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