Package Design: Simplify Process and Maximize Detail with the Package Builder
When discussing package design with our users and prospective clients, we found that two primary is…
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6 days ago
Ten Years of Simulation with 6SigmaET
This month, we at Future Facilities are celebrating ten years since the first release of our award-…
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3 weeks ago
New Power Map Feature: Simplified Modeling Made More Accurate
Previously, 6SigmaET could model the distribution of additional power to the top and bottom of a PC…
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1 month ago
CDNLive: The Importance of Electro-Thermal Co-Simulation in the Electronics Industry
Last month, I gave a talk at Cadence’s CDNLive event on the changing nature of electronics and th…
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1 month ago
6SigmaET Workshop 2019, 11 June 2019, London UK
You are invited to attend a free introductory 6SigmaET Workshop in London on Tuesday, 11 June 201…
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2 months ago
PCB Design & Manufacturing Live 2019, 9 May 2019, Silverstone UK
PCB Design & Manufacturing Live is the UK’s only dedicated exhibition for sourcing the electronic…
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2 months ago
Model Contact Resistance on Any Surface or CAD Shape
At Future Facilities, we are committed to delivering simulation software that replicates real-life…
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2 months ago
What Apple’s AirPower Teaches Us About the Importance of Thermal Simulation
AirPower, the wireless charging mat from Apple, was an ambitious venture. Following the AirPods (th…
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3 months ago
Expert Panel on Thermal Challenges in IT
At Future Facilities, we’re dedicated to developing the best thermal simulation products on the m…
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3 months ago
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