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Release 14: Introducing IPC-2581 Import Capability

Data transfer continues to be an electronics design bottleneck; however, certain global file format…
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2 weeks ago

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Liquid Cooling: 2020 Thermal Trends at the Semi-Therm Workshop

At the end of 2019, we attended the annual Semi-Therm symposium. Always an interesting and engaging…
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4 weeks ago

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Advancing AI Hardware: The Thermal Implications

Competition within the world of artificial intelligence hardware is heating up. The recent Hot Chi…
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2 months ago

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Release 14: Introducing Temperature Dependent Power Maps

6SigmaET empowers the thermal engineer to work with precision from the system level down to the die…
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3 months ago

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Release 14: Introducing the Unified Solver

6SigmaET provides the engineer with significant flexibility to accommodate every organization’s s…
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3 months ago

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Embedded Computing Design Podcast Highlights

With 6SigmaET celebrating its ten-year anniversary this year, we were lucky enough to be invited on…
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3 months ago

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Thermal Simulation of a Smart Pole Housing Active Electronics

The past decade saw the development of IoT devices and the rise of smart homes – where all househ…
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4 months ago

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Compact Component Modeling: Model the Multi-Resistor Network Faster with 6SigmaET

With technological advancements in package design, component manufacturers find it imperative to pr…
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5 months ago

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Burning Issues: The Thermal Challenges of “Wearables”

Wearable technology is on the rise. From fitness trackers and smartwatches, to implantables and hea…
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6 months ago

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