8 November, 2016
1 in 5 engineers confirm thermal issues are a common cause of expensive and time-consuming late stage design complications
New research from 6SigmaET team at Future Facilities, the leading thermal simulation tool provider, has found that 1 in 5 engineers confirm thermal issues are a common cause of expensive and time-consuming late stage design complications. Despite this, the survey of over 350 professional electronics engineers also revealed that 40% of engineers still consider thermal considerations to be a low priority in their current design process.
These findings are detailed in The Heat is On, a new report published today by the 6SigmaET team. The report examines the challenges and priorities of current electronics design and highlights how thermal considerations are too often neglected - particularly early in the design process.
Get a copy of the report here